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TI(德州仪器) SN74ABT2952A
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  • TI(德州仪器) SN74ABT2952A
  • TI(德州仪器) SN74ABT2952A
  • TI(德州仪器) SN74ABT2952A
  • TI(德州仪器) SN74ABT2952A
  • TI(德州仪器) SN74ABT2952A
  • TI(德州仪器) SN74ABT2952A
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SN74ABT2952A

SN74ABT2952A

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具有三态输出的八通道总线收发器和寄存器

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The 'ABT2952A transceivers consist of two 8-bit back-to-back registers that store data flowing in both directions between two bidirectional buses. Data on the A or B bus is stored in the registers on the low-to-high transition of the clock (CLKAB or CLKBA) input provided that the clock-enable (CLKENAB or CLKENBA) input is low. Taking the output-enable (OEAB or OEBA) input low accesses the data on either port.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54ABT2952A is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74ABT2952A is characterized for operation from -40°C to 85°C.

  • State-of-the-Art EPIC-II BTM BiCMOS Design Significantly Reduces Power Dissipation
  • Two 8-Bit Back-to-Back Registers Store Data Flowing in Both Directions
  • Noninverting Outputs
  • Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C
  • Latch-Up Performance Exceeds 500 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (NT) and Ceramic (JT) DIPs

EPIC is a trademark of Texas Instruments Incorporated.

Supply voltage (min) (V)4.5
Supply voltage (max) (V)5.5
Number of channels8
IOL (max) (mA)64
IOH (max) (mA)-32
Input typeTTL
Output type3-State
FeaturesOver-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns)
Technology familyABT
RatingCatalog
Operating temperature range (°C)-40 to 85
SOIC (DW)24159.65 mm² 15.5 x 10.3
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