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TI(德州仪器) SN74BCT652
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  • TI(德州仪器) SN74BCT652
  • TI(德州仪器) SN74BCT652
  • TI(德州仪器) SN74BCT652
  • TI(德州仪器) SN74BCT652
  • TI(德州仪器) SN74BCT652
  • TI(德州仪器) SN74BCT652
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SN74BCT652

SN74BCT652

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八通道总线收发器和寄存器

产品详情
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  • 特性
  • 参数
  • 封装 | 引脚 | 尺寸

These devices consist of bus transceiver circuits, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers.

Output-enable (OEAB and ) inputs are provided to control the transceiver functions. Select-control (SAB and SBA) inputs are provided to select whether real-time or stored data is transferred. The circuitry used for select control eliminates the typical decoding glitch that occurs in a multiplexer during the transition between stored and real-time data. A low input selects real-time data, and a high input selects stored data. Figure 1 illustrates the four fundamental bus-management functions that can be performed with the ´BCT652.

Data on the A or B data bus, or both, can be stored in the internal D-type flip-flops by low-to-high transitions at the appropriate clock (CLKAB or CLKBA) inputs regardless of the select- or enable-control pins. When SAB and SBA are in the real-time transfer mode, it is possible to store data without using the internal D-type flip-flops by simultaneously enabling OEAB and . In this configuration each output reinforces its input. Therefore, when all other data sources to the two sets of bus lines are at high impedance, each set of bus lines remain at its last state.

The SN54BCT652 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT652 is characterized for operation from 0°C to 70°C.

  • State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Independent Registers and Enables for A and B Buses
  • Multiplexed Real-Time and Stored Data
  • Power-Up High-Impedance Mode
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)

 

Supply voltage (min) (V)4.5
Supply voltage (max) (V)5.5
Number of channels8
IOL (max) (mA)64
IOH (max) (mA)-15
Input typeTTL
Output typeTTL
FeaturesVery high speed (tpd 5-10ns)
Technology familyBCT
RatingCatalog
Operating temperature range (°C)0 to 70
SOIC (DW)24159.65 mm² 15.5 x 10.3
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