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TI(德州仪器) MSPM0G3507-Q1
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  • TI(德州仪器) MSPM0G3507-Q1
  • TI(德州仪器) MSPM0G3507-Q1
  • TI(德州仪器) MSPM0G3507-Q1
  • TI(德州仪器) MSPM0G3507-Q1
  • TI(德州仪器) MSPM0G3507-Q1
  • TI(德州仪器) MSPM0G3507-Q1
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MSPM0G3507-Q1

MSPM0G3507-Q1

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具有 128KB 闪存、32KB SRAM、12 位 ADC、DAC、OPA 和 CAN-FD 的汽车类 80Mhz Arm® Cortex®-M0+ MCU

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MSPM0G350x microcontrollers (MCUs) are part of the MSP highly integrated, ultra-low-power 32-bit MCU family based on the enhanced Arm Cortex-M0+ 32-bit core platform operating at up to 80-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0G350x devices provide up to 128KB embedded flash program memory with built-in error correction code (ECC) and up to 32KB SRAM with hardware parity option. These MCUs also incorporate a memory protection unit, 7-channel DMA, math accelerator, and a variety of high-performance analog peripherals such as two 12-bit 4-Msps ADCs, configurable internal shared voltage reference, one 12-bit 1-Msps DAC, three high speed comparators with built-in reference DACs, two zero-drift zero-crossover op-amps with programmable gain, and one general-purpose amplifier. These devices also offer intelligent digital peripherals such as two 16-bit advanced control timers, five general-purpose timers (with one 16-bit general-purpose timer for QEI interface, two 16-bit general-purpose timers for STANDBY mode, and one 32-bit general-purpose timer), two windowed-watchdog timers, and one RTC with alarm and calendar modes. These devices provide data integrity and encryption peripherals (AES, CRC, TRNG) and enhanced communication interfaces (four UART, two I2C, two SPI , CAN 2.0/FD).

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The MSPM0 MCU platform combines the Arm Cortex-M0+ platform with a holistic ultra-low-power system architecture, allowing system designers to increase performance while reducing energy consumption.

MSPM0G350x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad available for purchase. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 G-Series 80-MHz Microcontrollers Technical Reference Manual.

  • Qualified for automotive applications
  • Core
    • Arm 32-bit Cortex-M0+ CPU with memory protection unit, frequency up to 80 MHz
  • Operating characteristics
    • Extended temperature: –40°C up to 125°C
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 128KB of flash memory with error correction code (ECC)
    • Up to 32KB of SRAM with hardware parity
  • High-performance analog peripherals
    • Two simultaneous sampling 12-bit 4-Msps analog-to-digital converters (ADCs) with up to 17 external channels
      • 14-bit effective resolution at 250-ksps with hardware averaging
    • One 12-bit 1-MSPS digital-to-analog converter with integrated output buffer (DAC)
    • Two zero-drift zero-crossover chopper op-amps (OPA)
      • 0.5-µV/°C drift with chopping
      • Integrated programmable gain stage, up to 32x
    • One general-purpose amplifier (GPAMP)
    • Three high-speed comparators (COMP) with 8-bit reference DACs
      • 32-ns propagation delay in high-speed mode
      • Support low-power mode operation down to 0.7 µA
    • Programmable analog connections between ADC, OPAs, COMP and DAC
    • Configurable 1.4-V or 2.5-V internal shared voltage reference (VREF)
    • Integrated temperature sensor
    • Integrated supply monitor
  • Optimized low-power modes
    • RUN: 96 µA/MHz (CoreMark)
    • SLEEP: 467 µA at 4 MHz
    • STOP: 46 µA at 32 kHz
    • STANDBY: 1.5 µA with RTC and SRAM retention
    • SHUTDOWN: 80 nA with IO wake-up capability
  • Intelligent digital peripherals
    • 7-channel DMA controller
    • Math accelerator supports DIV, SQRT, MAC and TRIG computations
    • Seven timers supports up to 22 PWM channels
      • One 16-bit general-purpose timer
      • One 16-bit general-purpose timer supports QEI
      • Two 16-bit general-purpose timers support low-power operation in STANDBY mode
      • One 32-bit high-resolution general-purpose timer
      • Two 16-bit advanced timers with deadband support up to 12 PWM channels
    • Two window-watchdog timers
    • RTC with alarm and calendar mode
  • Enhanced communication interfaces
    • Four UART interfaces; one supports LIN, IrDA, DALI, Smart Card, Manchester, and three support low-power operation in STANDBY mode
    • Two I 2C interfaces support up to FM+ (1 Mbit/s), SMBus/PMBus, and wakeup from STOP mode
    • Two SPIs, one SPI supports up to 32 Mbits/s

    • One Controller Area Network (CAN) interface supports CAN 2.0 A or B and CAN-FD
  • Clock system
    • Internal 4- to 32-MHz oscillator with up to ±1.2% accuracy (SYSOSC)
    • Phase-locked loop (PLL) up to 80 MHz
    • Internal 32-kHz low-frequency oscillator (LFOSC) with ±3% accuracy
    • External 4- to 48-MHz crystal oscillator (HFXT)
    • External 32-kHz crystal oscillator(LFXT)
    • External clock input
  • Data integrity and encryption
    • Cyclic redundancy checker (CRC-16, CRC-32)
    • True random number generator (TRNG)
    • AES encryption with 128 or 256-bit key
  • Flexible I/O features
    • Up to 60 GPIOs
      • Two 5-V tolerant IOs
      • Two high-drive IOs with 20-mA drive strength
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 64-pin LQFP
    • 48-pin LQFP, VQFN
    • 32-pin VQFN
    • 28-pin VSSOP
    • 24-pin VQFN
  • Family members (also see Device Comparison)
    • MSPM0G3505: 32KB flash, 16KB RAM
    • MSPM0G3506: 64KB flash, 32KB RAM
    • MSPM0G3507: 128KB flash, 32KB RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0G3507 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)
  • Automotive qualification
    • AEC-Q100 Grade 1 (-40°C to 125°C)
    • 24 , 32 and 48 -pin QFN with wettable flanks option
Frequency (MHz)80
Flash memory (kByte)128
RAM (kByte)32
Number of GPIOs24, 28, 44, 60
UART4
Number of I2Cs2
SPI2
Features5-V-tolerant I/Os, AES encryption, CAN FD, DMA, RTC, Zero-drift OpAmp
Operating temperature range (°C)-40 to 125
RatingAutomotive
LQFP (PT)4881 mm² 9 x 9
VQFN (RGE)2416 mm² 4 x 4
VQFN (RGZ)4849 mm² 7 x 7
VQFN (RHB)3225 mm² 5 x 5
VSSOP (DGS)2834.79 mm² 7.1 x 4.9
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