The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.
The OMAP platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.
The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.
The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS software kernel foundation, and is available in a 289-ball MicroStar BGA package.
The OMAP5910 is targeted at the following applications:
TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments.
ARM9TDMI is a trademark of ARM Limited.
Thumb is a registered trademark of ARM Limited.
Microwire is a trademark of National Semiconductor Corporation.
1-Wire is a registered trademark of Dallas Semiconductor Corporation.
IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture.
OMAP and DSP/BIOS are trademarks of Texas Instruments.
Bluetooth is a trademark owned by Bluetooth SIG, Inc.
Windows is a registered trademark of Microsoft Corporation.
Other trademarks are the property of their respective owners.
| Arm CPU | 1 Arm9 |
| Arm (max) (MHz) | 192 |
| Coprocessors | C55x DSP |
| CPU | 32-bit |
| Hardware accelerators | Motion Estimation for Video Compression, Pixel Interpolation, Video Hardware Accelerators for DCT/iDCT |
| Operating system | Linux, RTOS |
| Security | Device identity, Memory protection |
| Rating | Catalog |
| Operating temperature range (°C) | -40 to 85 |
| BGA (ZDY) | 289 | 361 mm² 19 x 19 |
| NFBGA (GVL) | 289 | 144 mm² 12 x 12 |
| NFBGA (ZVL) | 289 | 144 mm² 12 x 12 |
| PBGA (GDY) | 289 | 361 mm² 19 x 19 |