h1_key

• Rad-Tolerant: 100-kRad (Si) TID
• SEL Immune at 89MeV-cm2/mg LET Ions
• QML-V Qualified, SMD 5962-98661
• Highest-Performance Floating-Point Digital
  Signal Processor (DSP) SMJ320C6701
  • 7-ns Instruction Cycle Time
  • 140-MHz Clock Rate
  • Eight 32-Bit Instructions/Cycle
  • Up to One GFLOPS Performance
  • Pin Compatible With ’C6201 Fixed-Point DSP
• SMJ: QML Processing to MIL-PRF-38535
• SM: Standard Processing
• Operating Temperature Ranges
  • –55°C to 115°C
  • –55°C to 125°C
• VelociTI Advanced Very Long Instruction
  Word (VLIW) ’C67x CPU Core
  • Eight Highly Independent Functional Units:
    • Four ALUs (Floating and Fixed Point)
    • Two ALUs (Fixed Point)
    • Two Multipliers (Floating and Fixed Point)
  • Load-Store Architecture With 32
    32-Bit General-Purpose Registers
  • Instruction Packing Reduces Code Size
  • All Instructions Conditional
• Instruction Set Features
  • Hardware Support for IEEE Single-Precision
    Instructions
  • Hardware Support for IEEE Double-Precision
    Instructions
  • Byte Addressable (8-/16-/32-Bit Data)
  • 32-Bit Address Range
  • 8-Bit Overflow Protection
  • Saturation
  • Bit-Field Extract, Set, Clear
  • Bit Counting
  • Normalization
• 1M-Bit On-Chip SRAM
  • 512K-Bit Internal Program/Cache
    (16K 32-Bit Instructions)
  • 512K-Bit Dual-Access Internal Data
    (64K Bytes)
• 32-Bit External Memory Interface (EMIF)
  • Glueless Interface to Synchronous Memories:
    SDRAM and SBSRAM
  • Glueless Interface to Asynchronous Memories:
    SRAM and EPROM
• Four-Channel Bootloading
  Direct Memory Access (DMA) Controller
  With Auxiliary Channel
• 16-Bit Host-Port Interface (HPI)
  • Access to Entire Memory Map
• Two Multichannel Buffered Serial Ports (McBSPs)
  • Direct Interface to T1/E1, MVIP, SCSA Framers
  • ST Bus Switching Compatible
  • Up to 256 Channels Each
  • AC97 Compatible
  • Serial Peripheral Interface (SPI)
    Compatible (Motorola)
• Two 32-Bit General-Purpose Timers
• Flexible Phase-Locked Loop (PLL) Clock Generator
• IEEE Std 1149.1 (JTAG⁽¹⁾)
  Boundary Scan Compatible
• 429-Pin Ceramic Ball Grid Array (CBGA/GLP) and
  Ceramic Land Grid Array (CLGA/ZMB) Package Types
• 0.18-µm/5-Level Metal Process
  • CMOS Technology
• 3.3-V I/Os, 1.9 V Internal
• Engineering Evaluation (/EM) Samples are Available⁽²⁾

⁽¹⁾ IEEE Std 1149.1-1990 Test Access Port and Boundary Scan Architecture
⁽²⁾ These units are intended for engineering evaluation only. They are processed to a non-compliant flow (e.g. No Burn-In, etc.) and are tested to a temperature rating of 25°C only. These units are not suitable for qualification, production, radiation testing or flight use. Parts are not warranted for performance over the full MIL specified temperature range of –55°C to 125°C or operating life.