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TI(德州仪器) CSD86311W1723
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  • TI(德州仪器) CSD86311W1723
  • TI(德州仪器) CSD86311W1723
  • TI(德州仪器) CSD86311W1723
  • TI(德州仪器) CSD86311W1723
  • TI(德州仪器) CSD86311W1723
  • TI(德州仪器) CSD86311W1723
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CSD86311W1723

CSD86311W1723

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采用 1.7mm x 2.3mm WLP 封装的双通道共源极、42mΩ、25V、N 沟道 NexFET™ 功率 MOSFET

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The device has been designed to deliver the lowest on resistance and gate charge in the smallest outline possible with thermal characteristics in an ultra low profile. Low on resistance and gate charge coupled with the small footprint and low profile make the device ideal for battery operated space constrained application in load management as well as DC-DC converter applications

  • Dual N-Ch MOSFETs
  • Common Source Configuration
  • Small Footprint 1.7 mm × 2.3 mm
  • Ultra Low Qg and Qgd
  • Pb Free
  • RoHS Compliant
  • Halogen Free
  • APPLICATIONS
    • Battery Management
    • Battery Protection
    • DC-DC Converters

VDS (V)25
ConfigurationDual Common Source
Rds(on) at VGS=4.5 V (max) (mΩ)42
IDM - pulsed drain current (max) (A)4.5
QG (typ) (nC)3.1
QGD (typ) (nC)0.33
QGS (typ) (nC)0.85
VGS (V)10
VGSTH typ (typ) (V)1
ID - silicon limited at TC=25°C (A)4.5
ID - package limited (A)4.5
Logic levelYes
Operating temperature range (°C)-55 to 150
RatingCatalog
DSBGA (YZG)123.9375 mm² 2.25 x 1.75
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