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• Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
• Extended Temperature Performance of –55°C to 125°C
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree
• Low Output Skew, Low Pulse Skew for Clock-Distribution and Clock-Generation Applications
• Operates at 3.3-V V_CC
• LVTTL-Compatible Inputs and Outputs
• Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V V_CC)
• Distributes One Clock Input to 10 Outputs
• Outputs Have Internal Series Damping Resistor to Reduce Transmission Line Effects
• Distributed V_CC and Ground Pins Reduce Switching Noise
• State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation
• Shrink Small-Outline (DB) Package

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
EPIC-IIB is a trademark of Texas Instruments.