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TI(德州仪器) DS25CP152Q-Q1
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  • TI(德州仪器) DS25CP152Q-Q1
  • TI(德州仪器) DS25CP152Q-Q1
  • TI(德州仪器) DS25CP152Q-Q1
  • TI(德州仪器) DS25CP152Q-Q1
  • TI(德州仪器) DS25CP152Q-Q1
  • TI(德州仪器) DS25CP152Q-Q1
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DS25CP152Q-Q1

DS25CP152Q-Q1

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汽车类 3.125Gbps LVDS 2x2 交叉点开关

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The DS25CP152Q is a 3.125 Gbps 2x2 LVDS crosspoint switch optimized for high-speed signal routing and switching over lossy FR-4 printed circuit board backplanes and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity. The non-blocking architecture allows connections of any input to any output or outputs.

Wide input common mode range allows the switch to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. Each differential input and output is internally terminated with a 100Ω resistor to lower device return losses, reduce component count and further minimize board space.

  • AECQ-100 Grade 3
  • DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation
  • Pin Configurable, Fully Differential, Non-Blocking Architecture
  • On-chip 100Ω Input and Output Terminations Minimize Return Losses, Reduce Component Count and Minimize Board Space
  • 8 kV ESD on LVDS I/O Pins Protects Adjoining Components
  • Small 4 mm x 4 mm WQFN-16 Space Saving Package
FunctionCrosspoint
ProtocolsCML, LVDS, LVPECL
Number of transmitters2
Number of receivers2
Supply voltage (V)3.3
Signaling rate (MBits)3125
Input signalCML, LVDS, LVPECL
Output signalLVDS
RatingAutomotive
Operating temperature range (°C)-40 to 85
WQFN (RGH)1616 mm² 4 x 4
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