h1_key

• Controlled Baseline
  • One Assembly/Test Site, One Fabrication Site
• Enhanced Diminishing Manufacturing Sources (DMS) Support
• Enhanced Product-Change Notification
• Qualification Pedigree
• Integrated 110- Nominal Receiver Line Termination Resistor
• Operate From a Single 3.3-V Supply
• Greater Than 125-Mbps Data Rate
• Flow-Through Pinout
• LVTTL-Compatible Logic I/Os
• ESD Protection on Bus Pins Exceeds 12 kV
• Meet or Exceed Requirements of ANSI/TIA/EIA-644A Standard for LVDS
• 20-Pin Thin Shrink Small-Outline Package (PW) With 26-Mil Terminal Pitch
• APPLICATIONS
  • Memory Stick™ Interface Extensions With Long Interconnects Between Host and
    Memory Stick
  • Serial Peripheral Interface™ (SPI™) Interface Extension to Allow Long Interconnects
    Between Master and Slave
  • MultiMediaCard™ (MMC) Interface in SPI Mode
  • General-Purpose Asymmetric Bidirectional Communication

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
Serial Peripheral Interface, SPI are trademarks of Motorola.
MultiMediaCard is a trademark of MultiMediaCard Association.
Memory Stick is a trademark of Sony.