The AUP family is TI’s premier solution to the industry's low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see ). This product also maintains excellent signal integrity.
The output of SN74AUP3G07 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
| Technology family | AUP |
| Supply voltage (min) (V) | 0.8 |
| Supply voltage (max) (V) | 3.6 |
| Number of channels | 3 |
| IOL (max) (mA) | 4 |
| Supply current (max) (µA) | 0.9 |
| IOH (max) (mA) | 0 |
| Input type | Standard CMOS |
| Output type | Open-drain |
| Features | Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) |
| Rating | Catalog |
| Operating temperature range (°C) | -40 to 85 |
| DSBGA (YFP) | 8 | 1.8 mm² 1 x 1.8 |
| UQFN (RSE) | 8 | 2.25 mm² 1.5 x 1.5 |
| VSSOP (DCU) | 8 | 6.2 mm² 2 x 3.1 |
| X2SON (DQE) | 8 | 1.4 mm² 1.4 x 1 |
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