The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The SN74AUP2G17 contains two buffers and performs the Boolean function Y = A. The device functions as two independent buffers, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
NanoStar is a trademark of Texas Instruments
| Technology family | AUP |
| Supply voltage (min) (V) | 0.8 |
| Supply voltage (max) (V) | 3.6 |
| Number of channels | 2 |
| IOL (max) (mA) | 4 |
| Supply current (max) (µA) | 0.9 |
| IOH (max) (mA) | -4 |
| Input type | Schmitt-Trigger |
| Output type | Push-Pull |
| Features | Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) |
| Rating | Catalog |
| Operating temperature range (°C) | -40 to 85 |
| DSBGA (YFP) | 6 | 1.4000000000000001 mm² 1 x 1.4000000000000001 |
| SOT-SC70 (DCK) | 6 | 4.2 mm² 2 x 2.1 |
| USON (DRY) | 6 | 1.45 mm² 1.45 x 1 |
| X2SON (DSF) | 6 | 1 mm² 1 x 1 |
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