The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
(1) Additional temperature ranges are available - contact factory
NanoFree Is a trademark of Texas Instruments.
| Technology family | LVC |
| Supply voltage (min) (V) | 1.65 |
| Supply voltage (max) (V) | 5.5 |
| Number of channels | 1 |
| Inputs per channel | 3 |
| IOL (max) (mA) | 32 |
| IOH (max) (mA) | -32 |
| Input type | Standard CMOS |
| Output type | Push-Pull |
| Features | Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) |
| Data rate (max) (Mbps) | 100 |
| Rating | HiRel Enhanced Product |
| Operating temperature range (°C) | -55 to 125 |
| SOT-SC70 (DCK) | 6 | 4.2 mm² 2 x 2.1 |