AUP technology is the industrys lowest-power logic technology designed for use in battery-operated or battery backed-up equipment. The SN74AUP1T58 is designed for logic-level translation applications with input switching levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply.
The wide VCC range of 2.3 V to 3.6 V allows the possibility of battery voltage drop during system operation and ensures normal operation between this range.
Schmitt-trigger inputs (
VT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.
The SN74AUP1T58 can be easily configured to perform a required gate function by connecting A, B, and C inputs to VCC or ground (see Function Selection table). Up to nine commonly used logic gate functions can be performed.
Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions.
The SN74AUP1T58 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs.
NanoStar package technology is a major breakthrough in IC packaging concepts, using the die as the package.
NanoStar is a trademark of Texas Instruments.
| Technology family | AUP1T |
| Number of channels | 1 |
| Vout (min) (V) | 2.3 |
| Vout (max) (V) | 3.6 |
| Data rate (max) (Mbps) | 200 |
| IOH (max) (mA) | -4 |
| IOL (max) (mA) | 4 |
| Supply current (max) (µA) | 0.9 |
| Features | Over-voltage tolerant inputs, Partial power down (Ioff), Single supply |
| Input type | Schmitt-Trigger |
| Output type | Balanced CMOS, Push-Pull |
| Operating temperature range (°C) | -40 to 85 |
| DSBGA (YFP) | 6 | 1.4000000000000001 mm² 1 x 1.4000000000000001 |
| DSBGA (YZP) | 6 | 2.1875 mm² 1.75 x 1.25 |
| SOT-23 (DBV) | 6 | 8.12 mm² 2.9 x 2.8 |
| SOT-SC70 (DCK) | 6 | 4.2 mm² 2 x 2.1 |
| USON (DRY) | 6 | 1.45 mm² 1.45 x 1 |
| X2SON (DSF) | 6 | 1 mm² 1 x 1 |