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TI(德州仪器) SN74LV244AT
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  • TI(德州仪器) SN74LV244AT
  • TI(德州仪器) SN74LV244AT
  • TI(德州仪器) SN74LV244AT
  • TI(德州仪器) SN74LV244AT
  • TI(德州仪器) SN74LV244AT
  • TI(德州仪器) SN74LV244AT
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SN74LV244AT

SN74LV244AT

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具有 TTL 兼容型 CMOS 输入和三态输出的 8 通道、4.5V 至 5.5V 缓冲器

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  • 封装 | 引脚 | 尺寸

This octal buffer/driver is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

The SN74LV244AT is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE shall be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

  • Inputs Are TTL-Voltage Compatible
  • 4.5-V to 5.5-V VCC Operation
  • Typical tpd = 5.4 ns at 5 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 5 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2.3 V at VCC = 5 V, TA = 25°C
  • Supports Mixed-Mode Voltage Operation on All Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Technology familyLV-AT
Supply voltage (min) (V)4.5
Supply voltage (max) (V)5.5
Number of channels8
IOL (max) (mA)16
Supply current (max) (µA)20
IOH (max) (mA)-16
Input typeTTL-Compatible CMOS
Output type3-State
FeaturesBalanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns)
RatingCatalog
Operating temperature range (°C)-40 to 85
SOIC (DW)20131.84 mm² 12.8 x 10.3
SOP (NS)2098.28 mm² 12.6 x 7.8
TSSOP (PW)2041.6 mm² 6.5 x 6.4
VQFN (RGY)2015.75 mm² 4.5 x 3.5
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