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TI(德州仪器) SN74AUC2G32
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  • TI(德州仪器) SN74AUC2G32
  • TI(德州仪器) SN74AUC2G32
  • TI(德州仪器) SN74AUC2G32
  • TI(德州仪器) SN74AUC2G32
  • TI(德州仪器) SN74AUC2G32
  • TI(德州仪器) SN74AUC2G32
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SN74AUC2G32

SN74AUC2G32

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双通道、双输入、0.8V 至 2.7V、超高速 (2.4ns) 或门

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This dual 2-input positive-OR gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC2G32 performs the Boolean function Y = A + B or Y = A × B in positive logic.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027.

  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial-Power-Down Mode Operation
  • Sub-1-V Operable
  • Max tpd of 1.5 ns at 1.8 V
  • Low Power Consumption, 10 µA at 1.8 V
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

NanoFree is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.

Technology familyAUC
Supply voltage (min) (V)0.8
Supply voltage (max) (V)2.7
Number of channels2
Inputs per channel2
IOL (max) (mA)9
IOH (max) (mA)-9
Input typeStandard CMOS
Output typePush-Pull
FeaturesOver-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns)
Data rate (max) (Mbps)250
RatingCatalog
Operating temperature range (°C)-40 to 85
SSOP (DCT)811.8 mm² 2.95 x 4
VSSOP (DCU)86.2 mm² 2 x 3.1
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