This single inverter buffer and driver is designed for 1.65-V to 5.5-V VCC operation.
NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.
The output of the SN74LVC1G06 device is open-drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.
| Technology family | LVC |
| Supply voltage (min) (V) | 1.65 |
| Supply voltage (max) (V) | 5.5 |
| Number of channels | 1 |
| IOL (max) (mA) | 32 |
| IOH (max) (mA) | 0 |
| Supply current (max) (µA) | 10 |
| Input type | Standard CMOS |
| Output type | Open-drain |
| Features | Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) |
| Rating | Catalog |
| Operating temperature range (°C) | -40 to 125 |
| DSBGA (YZP) | 5 | 2.1875 mm² 1.75 x 1.25 |
| DSBGA (YZV) | 4 | 1.5625 mm² 1.25 x 1.25 |
| SOT-23 (DBV) | 5 | 8.12 mm² 2.9 x 2.8 |
| SOT-5X3 (DRL) | 5 | 2.56 mm² 1.6 x 1.6 |
| SOT-SC70 (DCK) | 5 | 4.2 mm² 2 x 2.1 |
| USON (DRY) | 6 | 1.45 mm² 1.45 x 1 |
| X2SON (DPW) | 5 | 0.64 mm² 0.8 x 0.8 |
| X2SON (DSF) | 6 | 1 mm² 1 x 1 |
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