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TI(德州仪器) CY74FCT2245T
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  • TI(德州仪器) CY74FCT2245T
  • TI(德州仪器) CY74FCT2245T
  • TI(德州仪器) CY74FCT2245T
  • TI(德州仪器) CY74FCT2245T
  • TI(德州仪器) CY74FCT2245T
  • TI(德州仪器) CY74FCT2245T
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CY74FCT2245T

CY74FCT2245T

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具有三态输出和串联阻尼电阻的八通道总线收发器

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The CY74FCT2245T contains eight noninverting, bidirectional buffers with 3-state outputs intended for bus-oriented applications. On-chip termination resistors at the outputs reduce system noise caused by reflections. For this reason, the CY74FCT2245T can replace the CY74FCT245T in an existing design. The CY74FCT2245T current-sinking capability is 12 mA at the A and B ports.

The transmit/receive (T/R) input determines the direction of data flow through the bidirectional transceiver. Transmit (active high) enables data from A ports to B ports; receive (active low) enables data from B ports to A ports. The output-enable (OE) input, when high, disables both the A and B ports by putting them in the high-impedance state.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

  • Function and Pinout Compatible With FCT and F Logic
  • 25- Output Series Resistors to Reduce Transmission-Line Reflection Noise
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • 12-mA Output Sink Current
    15-mA Output Source Current
  • 3-State Outputs

Supply voltage (min) (V)4.75
Supply voltage (max) (V)5.25
Number of channels8
IOL (max) (mA)12
IOH (max) (mA)-15
Input typeTTL
Output typeTTL
FeaturesDamping resistors, Partial power down (Ioff), Very high speed (tpd 5-10ns)
Technology familyFCT
RatingCatalog
Operating temperature range (°C)-40 to 85
PDIP (N)20228.702 mm² 24.33 x 9.4
SOIC (DW)20131.84 mm² 12.8 x 10.3
SSOP (DBQ)2051.9 mm² 8.65 x 6
TSSOP (PW)2041.6 mm² 6.5 x 6.4
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