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TI(德州仪器) SN74LVTZ244
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  • TI(德州仪器) SN74LVTZ244
  • TI(德州仪器) SN74LVTZ244
  • TI(德州仪器) SN74LVTZ244
  • TI(德州仪器) SN74LVTZ244
  • TI(德州仪器) SN74LVTZ244
  • TI(德州仪器) SN74LVTZ244
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SN74LVTZ244

SN74LVTZ244

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具有总线保持、TTL 兼容型 CMOS 输入和三态输出的 8 通道、2.7V 至 3.6V 缓冲器

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These octal buffers/drivers are designed specifically for low-voltage (3.3-V) VCC operation with the capability to provide a TTL interface to a 5-V system environment.

These devices are organized as two 4-bit line drivers with separate output-enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74LVTZ244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.

The SN54LVTZ244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTZ244 is characterized for operation from -40°C to 85°C.

 

 

  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
  • High-Impedance State During Power Up and Power Down
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
  • Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) DIPs
Technology familyLVT
Supply voltage (min) (V)2.7
Supply voltage (max) (V)3.6
Number of channels8
IOL (max) (mA)64
Supply current (max) (µA)15000
IOH (max) (mA)-32
Input typeTTL-Compatible CMOS
Output type3-State
FeaturesBus-hold, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns)
RatingCatalog
Operating temperature range (°C)-40 to 85
SOIC (DW)20131.84 mm² 12.8 x 10.3
SSOP (DB)2056.16 mm² 7.2 x 7.8
TSSOP (PW)2041.6 mm² 6.5 x 6.4
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