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TI(德州仪器) SN74ACT534
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  • TI(德州仪器) SN74ACT534
  • TI(德州仪器) SN74ACT534
  • TI(德州仪器) SN74ACT534
  • TI(德州仪器) SN74ACT534
  • TI(德州仪器) SN74ACT534
  • TI(德州仪器) SN74ACT534
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SN74ACT534

SN74ACT534

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具有三态输出的八路边沿 D 类触发器

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These octal edge-triggered D-type flip-flops feature 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The devices are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

On the positive transition of the clock (CLK) input, the Q outputs are set to the complements of the logic levels set up at the data (D) inputs.

A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components.

OE does not affect internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

  • 4.5-V to 5.5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 10.5 ns at 5 V
  • Inputs Are TTL-Voltage Compatible
  • 3-State Inverting Outputs Drive Bus Lines Directly
  • Full Parallel Access for Loading

Number of channels8
Technology familyACT
Supply voltage (min) (V)4.5
Supply voltage (max) (V)5.5
Input typeTTL-Compatible CMOS
Output type3-State
Clock frequency (max) (MHz)90
IOL (max) (mA)24
IOH (max) (mA)-24
Supply current (max) (µA)40
FeaturesBalanced outputs, Positive input clamp diode, Very high speed (tpd 5-10ns)
Operating temperature range (°C)-40 to 85
RatingCatalog
PDIP (N)20228.702 mm² 24.33 x 9.4
SOIC (DW)20131.84 mm² 12.8 x 10.3
SOP (NS)2098.28 mm² 12.6 x 7.8
TSSOP (PW)2041.6 mm² 6.5 x 6.4
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