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ADIS16501

推荐用于新设计

Precision, MEMS IMU

ADI亚德诺 ADIS16501 产品介绍
2026-03-09 0次

特性


  • Triaxial digital gyroscope, ±500°/sec
    • 2.7°/hr in-run bias stability
    • 0.15°/√hr angular random walk, x-axis and y-axis, 1 σ
    • ±0.25° axis to axis misalignment error
  • Triaxial digital accelerometer, ±14 g dynamic range
    • 12.7 μg in-run bias stability (x-axis and y-axis)
  • Triaxial delta angle and delta velocity outputs
  • Factory calibrated sensitivity, bias, and axial alignment
    • Calibration temperature range: −40°C to +85°C
  • SPI compatible data communications
  • Programmable operation and control
    • Automatic and manual bias correction controls
    • Data ready indicator for synchronous data acquisition
    • External sync modes: direct, scaled, and output
    • On demand self test of inertial sensors
  • Single-supply operation (VDD): 3.0 V to 3.6 V
  • 1500 g mechanical shock survivability
  • Operating temperature range: −40°C to +105°C

产品详情和应用


The ADIS16501 is a precision, miniature microelectromechanical system (MEMS) inertial measurement unit (IMU) that includes a triaxial gyroscope and a triaxial accelerometer. Each inertial sensor in the ADIS16501 combines with signal conditioning that optimizes dynamic performance. The factory calibration characterizes each sensor for sensitivity, bias, alignment, linear acceleration (gyroscope bias), and point of percussion (accelerometer location).

The ADIS16501 provides a simplified, cost-effective method for integrating accurate, multiaxis inertial sensing into industrial systems, especially when compared with the complexity and investment associated with discrete designs. All necessary motion testing and calibration are part of the production process at the factory, greatly reducing system integration time. Tight orthogonal alignment simplifies inertial frame alignment in navigation systems. The serial peripheral interface (SPI) and register structure provide a simple interface for data collection and configuration control.

The ADIS16501 is available in a 100-ball ball grid array (BGA) module (MODULE) that is approximately 15 mm × 15 mm × 5.72 mm.

APPLICATIONS

  • Navigation, stabilization, and instrumentation
  • Unmanned and autonomous vehicles
  • Smart agriculture and construction machinery
  • Factory/industrial automation, robotics
  • Virtual/augmented reality
  • Internet of Moving Things
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