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Infineon英飞凌 IAUCN10S7N025T 产品介绍
2026-04-14
0次
产品详情
- Enables excellent thermal management
- Thermal impedance improved 20% to 50%
- Thermal resistance improved 20% to 50%
- Helps reduce ECU volume or PCB area
- Helps reduce PCB cost (area, Cu, vias)
- Reduces PCB and system design effort
- Helps achieve highest power density
- Minimized conduction losses
- Superior switching performance
- Well-suited for parallel placement
- Quality and robustness for automotive
- Potential for second source supplier
特性
- Direct cooling path to ECU housing
- Virtually no heat flows into PCB
- Industry’s largest exposed pad area
- Freedom to route traces under package
- Can mount parts on back side of PCB
- Industry’s best on-resistance, R<sub>DS(on)</sub>
- Fast switching times (turn on/off)
- Tight threshold voltage, V<sub>GS(th)</sub>, range
- Extended qualification beyond AEC-Q101
- Enhanced electrical testing
- Package is listed with JEDEC
参数
类型 | 描述 |
最高 ID (@25°C) | 175 A |
最高 QG (typ @10V) | 93 nC |
QG (typ @10V) | 71 nC |
最高 RDS (on) (@10V) | 2.5 mΩ |
最高 VDS | 100 V |
VGS(th) 范围 | 2.3 V 至 3.2 V |
VGS(th) | 2.8 V |
封装 | PG-LHDSO-10 |
工作温度 范围 | -55 °C 至 175 °C |
技术 | OptiMOS™ 7 |
极性 | N |
目前计划的可用性至少到 | 2040 |
认证标准 | Automotive |
