h1_key

产品详情

• Enables excellent thermal management
• Thermal impedance improved 20% to 50%
• Thermal resistance improved 20% to 50%
• Helps reduce ECU volume or PCB area
• Helps reduce PCB cost (area, Cu, vias)
• Reduces PCB and system design effort
• Superior switching performance
• Quality and robustness for automotive
• Potential for second source supplier

特性

• Direct cooling path to ECU housing
• Virtually no heat flows into PCB
• Industry’s largest exposed pad area
• Freedom to route traces under package
• Can mount parts on back side of PCB
• Fast switching times (turn on/off)
• Extended qualification beyond AEC-Q101
• Enhanced electrical testing
• Package is listed with JEDEC

参数