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Infineon英飞凌 IAUCN04S7N010G 产品介绍
2026-04-14
0次
产品详情
- Highest power and current density
- High thermal capacity, lead-frame pkg
- Reduced conduction losses
- Optimized switching behavior
- High TCOB for IMS PCBs
- Legacy Footprint Design Compatibility
- Automotive robust package
特性
- 5x6 mm² footprint
- High current capability
- OptiMOS-7 40V, leading-edge tech
- RDS range: 1.0 mΩ – 4.7 mΩ
- Leaded Cu-Clip; IMS & legacy footprint
- High avalanche capability; rugged SOA
参数
类型 | 描述 |
Country of Assembly (Last BE site, current, subject to change) | Malaysia |
Country of Diffusion (Last FE site, current, subject to change) | Austria, Germany |
最高 ID (@25°C) | 175 A |
最高 QG (typ @10V) | 77 nC |
QG (typ @10V) | 59 nC |
最高 RDS (on) (@10V) | 1.04 mΩ |
最高 VDS | 40 V |
VGS(th) 范围 | 2.2 V 至 3 V |
VGS(th) | 2.6 V |
封装 | SSO4G |
工作温度 范围 | -55 °C 至 175 °C |
技术 | OptiMOS™-7 |
极性 | N |
目前计划的可用性至少到 | 2038 |
认证标准 | Automotive |
