h1_key

产品详情

• Higher temperature cycling capability
• Integrated on-chip temperature sensor
• New plastic material
• Better temperature capability
• Improved thermal conductivity
• Lower system BOM
• Lower AC contact resistance
• Lower tab temperature
• PressFIT Contact Technology
• RoHS compliant
• Completely Pb free
• Superior reliability

特性

• EDT3 IGBT/Diode & CoolSiC Gen2 MOSFET
• Optimized for simultaneous gate drive
• Integrated on-chip temperature sensor
• Low conduction and switching losses
• Low inductive design
• Tvj,op = 175°C
• 4.25kV DC 1s insulation
• High power density
• Direct-cooled PinFin base plate
• PressFIT contact technology
• High-performance Si3N4 ceramic
• Guiding elements for PCB & cooler assembly

参数