Infineon英飞凌 FS02MR08A7MA2B 产品介绍
2026-04-14
0次
产品详情
- Higher temperature cycling capability
- Integrated diode temperature sensors
- New plastic material
- Better temperature capability
- Lower system BOM
- Lower AC contact resistance
- Lower tab temperature
- PressFIT Contact Technology
- RoHS compliant
- Completely Pb free
- Superior reliability
特性
- Short-time operation@Tvj,op = 200 °C
- Guide elements for PCB & cooler assembly
- Silicon carbide material
- Low RDS(on)
- Low switching losses
- Tvj,op = 175°C
- 4.2kV DC 1s insulation
- High power density
- Direct-cooled PinFin base plate
- Integrated temp sensing diode
- PressFIT contact technology
- Compact design
参数
类型 | 描述 |
最高 RthJC | 0.139 K/W |
VCES (Tvj=25°C typ) | 750 V |
封装 | HybridPACK™ Drive G2 |
技术 | CoolSiC™ G2 |
推出年份 | 2026 |
特性 | PinFin Base Plate, Short tabs |
最高 电压等级 | 750 V |
目前计划的可用性至少到 | 2042 |
认证标准 | Automotive |
配置 | Sixpack |



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